for enquiry
DIAS Automation designs and manufactures advanced equipment for packaging of Semiconductor Chip, LED, Surface Mount Component or other micro devices onto a Substrate, Lead Frame, PCB, Flex Circuits etcs. The main product lines include Die Bonder, Die Sorter, Ultrasonic Wire Bonder, Dispensing and Inspection Systems.
Automatic Die Bonder model DA-750 / DA-750-300
- Fully programmable Rotary P&P Head
- Perform P&P immediately after dispensing
- Top view & post pick up looking CCTV with zoom lens
- Precise control of placement rotation and accuracy
- Precise control programmable epoxy dispensing
- Precise control of bonding force and bond line thickness
- Quick conversion Wafer / Tray Holders and tooling
- Automatic Input Wafer Loader for up to 300 mm wafer
- Programmable Output Magazine Handler
- Powerful Wafer Map processing capability
- Real time process monitoring
- Graphical user interface menu with color LCD displays
Automatic Die Sorter model DS-750 / DS-750-300
- Fully programmable Rotary P&P Head
- Top view & post pick up looking CCTV with zoom lens
- Precise control of placement rotation and accuracy
- Precise control of bonding force
- Flexible input - output configurations for Wafer-Wafer, Wafer-Tray, Tray-Tray
- Quick conversion Wafer / Tray Holders and tooling
- Option for output to Tape & Reel
- Automatic Input Wafer Loader for up to 300 mm wafer
- Programmable Output Magazine Handler
- Powerful Wafer Map processing & sorting features
- Real time process monitoring
- Graphical user interface menu with color LCD displays
Automatic Wedge Bonder model RB-630 / RB-630-H
- Modular design Rotary Bonding Head and Work Holder
- Bonding Speed up to 4 wires per second
- Bonding Area up to 200 mm x 150 mm
- Up to 5 mm clearance for SMT components
- Digital Bond Quality Monitoring and Enhancement system
- High resolution CCTV with automatic focusing and lighting adjustment
- Automatic Die and Bond Pad alignment via image recognition system
- Multi Die / Matrix bonding capability
- High return of investment
- "Windows" based user friendly operating menu with LCD color monitor
- Simple set-up and quick maintenance
- Option for Automatic Load / Unload from Magazine
- Option for Heated Work Holder (for Gold Wire bonding)
Automatic Dispensing System for Substrate / Carrier mounted products model LD-838 / LD-838-DH
- AC Servo-driven Pen-write Dispensing Head
- Up to 3 Independent Working Zones for Preheat – Dispense – Curing
- Programmable walking beam or conveyer indexing system
- Pneumatic driven Up-Down supports, Heater Block and Top Clamp
- Top View CCTV with 7xZoom Lens & Programmable LED Lightings
- Automatic alignment through Vision Recognition System
- Post dispense verification
- Auto Needle XYZ Calibration Sensors
- Automatic Working Height Detection (Laser / Touch Probe)
- Flexible Dispensers configurations with liquid sensors
- Automatic needle cleaning vacuum stage
- Optional Multi Magazine Input and Output Elevators
- Optional Weighing Scale
- 6X Stereo Zoom Microscope with sliding Focusing Arm
- Windows based user friendly menu with color LCD Monitors
Automatic Dispensing System for Lead Frame mounted products model FC-33-A / FC-33-UV
- AC Servo-driven Pen-write Dispensing Head
- Programmable unit locations by panels / matrix
- Strip Map processing capability
- Fully Programmable Mag-to-Mag Lead Frame Handler with side gripper indexing system
- Pneumatic driven Up-Down support / Heater Block and Top Clamp
- Top View CCTV with 7xZoom Lens & Programmable LED Lightings
- Automatic alignment through Vision Recognition System
- Post dispense verification
- Auto Needle XYZ Calibration Sensors
- Automatic Working Height Detection (Laser / Touch Probe)
- Automatic needle cleaning vacuum stage
- High precision intelligent Dispenser
- Optional UV Curing chamber after dispense
- 6X Stereo Zoom Microscope with sliding Focusing Arm
- Windows based user friendly menu with color LCD Monitors
Automatic Manual Loading Dispensing System model FC-33-M
- AC Servo-driven Pen-write Dispensing Head
- Manual loading Work Holder with custom tooling for efficient loading and high productivity
- Top View CCTV with 7xZoom Lens & Programmable LED Lightings
- Automatic alignment through Vision Recognition System
- Post dispense verification
- Auto Needle XYZ Calibration Sensors
- Automatic Working Height Detection (Laser / Touch Probe)
- Flexible Dispensers configurations with liquid sensors
- Automatic needle cleaning vacuum stage
- Optional Weighing Scale
- 6X Stereo Zoom Microscope with sliding Focusing Arm
- Windows based user friendly menu with color LCD Monitors
Post bond Inspection Station model IS-33-B
- Fully programmable side gripper Indexing System
- Flexible setting for store forwards or backwards
- Capability to handle thin, wide & long strips
- High accuracy programmable XY Table
- User programmable defects classifications
- User programmable inspection modes
- Data Collection for production or QC
- Strip Mapping, reporting and networking capabilities
- Online Process Control and Yield Monitoring
- High quality images of Microscope / CCTV
- Options for Top / Bottom / 45 Deg view observations
- Live display of image, Map machine status
- Options for permanent visual reject identifications (Inker, Puncher, Scriber etc.)
- Ergonomic design with small foot print
Post bond Inspection Station model IS-5-B
- Fully programmable side gripper Indexing System
- Single side Elevator for store backwards
- Capability to handle thin, wide & long strips
- High accuracy programmable XY Table
- User programmable defects classifications
- User programmable inspection modes
- Data Collection for production or QC
- Strip Mapping, reporting and networking capabilities
- Online Process Control and Yield Monitoring
- High quality images of Microscope / CCTV
- Options for Top / Bottom / 45 Deg view observations
- Live display of image, Map machine status
- Options for permanent visual reject identifications (Inker, Puncher, Scriber etc.)
- Option for automatic vision inspection
- Ergonomic design with small foot print