for enquiry


DIAS Automation designs and manufactures advanced equipment for packaging of Semiconductor Chip, LED, Surface Mount Component or other micro devices onto a Substrate, Lead Frame, PCB, Flex Circuits etcs. The main product lines include Die Bonder, Die Sorter, Ultrasonic Wire Bonder, Dispensing and Inspection Systems.



Automatic Die Bonder model DA-750 / DA-750-300
  • Fully programmable Rotary P&P Head
  • Perform P&P immediately after dispensing
  • Top view & post pick up looking CCTV with zoom lens
  • Precise control of placement rotation and accuracy
  • Precise control programmable epoxy dispensing
  • Precise control of bonding force and bond line thickness
  • Quick conversion Wafer / Tray Holders and tooling
  • Automatic Input Wafer Loader for up to 300 mm wafer
  • Programmable Output Magazine Handler
  • Powerful Wafer Map processing capability
  • Real time process monitoring
  • Graphical user interface menu with color LCD displays

Automatic Die Sorter model DS-750 / DS-750-300
  • Fully programmable Rotary P&P Head
  • Top view & post pick up looking CCTV with zoom lens
  • Precise control of placement rotation and accuracy
  • Precise control of bonding force
  • Flexible input - output configurations for Wafer-Wafer, Wafer-Tray, Tray-Tray
  • Quick conversion Wafer / Tray Holders and tooling
  • Option for output to Tape & Reel
  • Automatic Input Wafer Loader for up to 300 mm wafer
  • Programmable Output Magazine Handler
  • Powerful Wafer Map processing & sorting features
  • Real time process monitoring
  • Graphical user interface menu with color LCD displays

Automatic Wedge Bonder model RB-630 / RB-630-H
  • Modular design Rotary Bonding Head and Work Holder
  • Bonding Speed up to 4 wires per second
  • Bonding Area up to 200 mm x 150 mm
  • Up to 5 mm clearance for SMT components
  • Digital Bond Quality Monitoring and Enhancement system
  • High resolution CCTV with automatic focusing and lighting adjustment
  • Automatic Die and Bond Pad alignment via image recognition system
  • Multi Die / Matrix bonding capability
  • High return of investment
  • "Windows" based user friendly operating menu with LCD color monitor
  • Simple set-up and quick maintenance
  • Option for Automatic Load / Unload from Magazine
  • Option for Heated Work Holder (for Gold Wire bonding)

Automatic Dispensing System for Substrate / Carrier mounted products model LD-838 / LD-838-DH
  • AC Servo-driven Pen-write Dispensing Head
  • Up to 3 Independent Working Zones for Preheat ĘC Dispense ĘC Curing
  • Programmable walking beam or conveyer indexing system
  • Pneumatic driven Up-Down supports, Heater Block and Top Clamp
  • Top View CCTV with 7xZoom Lens & Programmable LED Lightings
  • Automatic alignment through Vision Recognition System
  • Post dispense verification
  • Auto Needle XYZ Calibration Sensors
  • Automatic Working Height Detection (Laser / Touch Probe)
  • Flexible Dispensers configurations with liquid sensors
  • Automatic needle cleaning vacuum stage
  • Optional Multi Magazine Input and Output Elevators
  • Optional Weighing Scale
  • 6X Stereo Zoom Microscope with sliding Focusing Arm
  • Windows based user friendly menu with color LCD Monitors

Automatic Dispensing System for Lead Frame mounted products model FC-33-A / FC-33-UV
  • AC Servo-driven Pen-write Dispensing Head
  • Programmable unit locations by panels / matrix
  • Strip Map processing capability
  • Fully Programmable Mag-to-Mag Lead Frame Handler with side gripper indexing system
  • Pneumatic driven Up-Down support / Heater Block and Top Clamp
  • Top View CCTV with 7xZoom Lens & Programmable LED Lightings
  • Automatic alignment through Vision Recognition System
  • Post dispense verification
  • Auto Needle XYZ Calibration Sensors
  • Automatic Working Height Detection (Laser / Touch Probe)
  • Automatic needle cleaning vacuum stage
  • High precision intelligent Dispenser
  • Optional UV Curing chamber after dispense
  • 6X Stereo Zoom Microscope with sliding Focusing Arm
  • Windows based user friendly menu with color LCD Monitors

Automatic Manual Loading Dispensing System model FC-33-M
  • AC Servo-driven Pen-write Dispensing Head
  • Manual loading Work Holder with custom tooling for efficient loading and high productivity
  • Top View CCTV with 7xZoom Lens & Programmable LED Lightings
  • Automatic alignment through Vision Recognition System
  • Post dispense verification
  • Auto Needle XYZ Calibration Sensors
  • Automatic Working Height Detection (Laser / Touch Probe)
  • Flexible Dispensers configurations with liquid sensors
  • Automatic needle cleaning vacuum stage
  • Optional Weighing Scale
  • 6X Stereo Zoom Microscope with sliding Focusing Arm
  • Windows based user friendly menu with color LCD Monitors

Post bond Inspection Station model IS-33-B
  • Fully programmable side gripper Indexing System
  • Flexible setting for store forwards or backwards
  • Capability to handle thin, wide & long strips
  • High accuracy programmable XY Table
  • User programmable defects classifications
  • User programmable inspection modes
  • Data Collection for production or QC
  • Strip Mapping, reporting and networking capabilities
  • Online Process Control and Yield Monitoring
  • High quality images of Microscope / CCTV
  • Options for Top / Bottom / 45 Deg view observations
  • Live display of image, Map machine status
  • Options for permanent visual reject identifications (Inker, Puncher, Scriber etc.)
  • Ergonomic design with small foot print

Post bond Inspection Station model IS-5-B
  • Fully programmable side gripper Indexing System
  • Single side Elevator for store backwards
  • Capability to handle thin, wide & long strips
  • High accuracy programmable XY Table
  • User programmable defects classifications
  • User programmable inspection modes
  • Data Collection for production or QC
  • Strip Mapping, reporting and networking capabilities
  • Online Process Control and Yield Monitoring
  • High quality images of Microscope / CCTV
  • Options for Top / Bottom / 45 Deg view observations
  • Live display of image, Map machine status
  • Options for permanent visual reject identifications (Inker, Puncher, Scriber etc.)
  • Option for automatic vision inspection
  • Ergonomic design with small foot print