Standard Models |
|
| Die Attach / Die Sorter |
|
| DA-750 | Automatic Epoxy Die Bonder for up to 200mm wafer |
| DA-750-300 | Automatic Epoxy Die Bonder for up to 300mm wafer |
| DS-750 | Automatic Die Sorter for up to 200mm wafer |
| DS-750-300 | Automatic Die Sorter for up to 300mm wafer |
| |
|
| Ultrasonic Wire Bonder |
|
| RB-630 | Rotary Head Wedge Bonder for aluminum or gold wire, 200mmx150mm bonding area |
| |
|
| Dispensing Equipment |
|
| FC-33-A | Dispensing System with programmable handler for lead frame or substrate products |
| FC-33-UV | Dispensing System with programmable handler for lead frame or substrate products with post dispense UV curing process |
| FC-33-M | Dispensing System with manual loading stage and work holder |
| LD-838 | Dispensing System with programmable handler for substrate or carrier mounted devices with pre-heat, post heat, optional multi magazine handler |
| LD-838-DH | Dispensing System with dual independent XYZ dispensing heads, programmable handler for substrate or carrier mounted devices with pre-heat, post heat, optional multi magazine handler |
| |
|
| Inspection Station |
|
| IS-33-B | Dual Elevator post bond Inspection Station, with programmable XY Table |
| IS-5-B | Single Elevator post bond Inspection Station, with programmable XY Table |
| IS-5-M | Single Elevator post bond Inspection Station, with manual XY Table |